Flexible Epoxy Resin Potting Compound Manufacturers Factory Suppliers

Fong Yong E759/H759 is a A/B component, ambient temperature cure, flame-retardant UL-94v0 modified epoxy resin, widely used on electronic potting, encapsulating and casting.

E-120/H-100 cures fully at room temperature — no oven or heating equipment required. Shore D 82, flexural strength 13,000 psi, low exotherm that will not harm electronic components. Clear

E533/H533 delivers 1.5 W/m·K thermal conductivity and Tg 127°C for thick-section power electronics potting where heat accumulation causes component failure. Heat cure required. NOTE: UL follow-up

An engineering overview of epoxy potting compounds for electronics encapsulation. Compare cure options, rigidity, and production considerations, and navigate to product-specific pages for validation.

EP-1109-11 is a one-component, black, low halogen carbon-filled electrically conductive epoxy adhesive.

E-590B-1/H-590 is a two-component, pourable, black, hard, thermally conductive epoxy potting compound.

E532-1A(D)/H532-1B(D) is a two-part, fast cure, flammable retardant UL-94vo epoxy adhesive compound that cures at room temperature.

Fong Yong 5 minutes epoxy bonding adhesive E-906/H-906 is a two-component adhesive composed of epoxy resin and hardener.

E-700/H-190 electronic potting epoxy resin. Shore D 80, 480 V/mil dielectric strength. RT or two-stage heat cure. Standard encapsulant for electronics.

E-750/H-750 is a Shore A 65 flexible epoxy potting compound that accommodates thermal expansion mismatch. Service temperature -30°C to +80°C. 1:1 mix ratio. RT or heat cure.

E-190/H-190 is a low-exotherm clear epoxy for large-component potting. Shore D 80, Tg 75°C, service temperature -30°C to +90°C. RT or heat cure (80°C × 2 hrs). Two mix ratio options.

Fong Yong EP-10C#7-BK is an one component, thermal curing epoxy adhesive for bonding, sealing, coating and encapsulation. It exhibits excellent physical properties, excellent electrical insulation