Electronic Potting Epoxy Resin | E-700/H-190 | Shore D 80 | Fong Yong

Fong Yong Chemical Co., Ltd. is one of the leading manufacturers and suppliers of Electronic Potting Epoxy Resin | E-700/H-190 | Shore D 80 | Fong Yong in Taiwan. With abundant experience, we warmly welcome you to buy high quality customized products at competitive price from our factory. If you have any enquiry about quotation, please feel free to email us.

 

What Is E-700/H-190?

E-700/H-190 is a two-component, 100%-solids modified epoxy potting compound for general electrical and electronic component encapsulation, manufactured by Fong Yong Chemical Co., Ltd., an IATF 16949 certified manufacturer, in Taiwan. It is the standard general-purpose specification in the Fong Yong clear potting range - the correct choice for PCB assemblies, sensors, coils, connectors, and electronic modules in indoor or industrial environments where electrical insulation, moisture resistance, and mechanical protection are the primary requirements and no special condition (large volume, thermal cycling, appearance, LED) applies. Mix ratio is 100:40 by weight (E-700 resin : H-190 hardener). Cure: 7 days at room temperature, or 80°C × 2 hours + 120°C × 2 hours (heat cure, two-stage). Pot life 60 minutes at 25°C. Fully cured: Shore D 80, dielectric strength 480 V/mil (≈18.9 KV/mm), volume resistivity 5×10¹⁵ Ω·cm, water absorption 0.15%, shelf life 8 months.

 

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E-700/H-190 is a two-component modified electronic potting epoxy resin for electrical and electronic component encapsulation. It covers the full range of standard encapsulation requirements - electrical insulation, moisture resistance, and mechanical protection at Shore D 80. When the application is standard electronic potting with no special condition, E-700/H-190 is the correct specification.

 

E-700/H-190 Is the Right Specification When:

• The application is standard electrical or electronic component encapsulation in an indoor or controlled environment
• Electrical insulation and moisture resistance are the primary encapsulant requirements
• Heat cure equipment capable of 120°C is available, or room temperature cure fits the production process

 

Special conditions that require a different formula: large-volume potting with exotherm concern → E-190/H-190 · thermal cycling or vibration → E-750/H-750 · appearance-sensitive or low moisture absorption → E-132/H-100 · no oven, RT cure primary → E-120/H-100 · LED 140°C+ service → E-600/H-600

 

When E-700/H-190 Is the Right Electronic Potting Epoxy Resin

Figure 1. E-700/H-190 is the correct specification for standard electronic potting. Five conditions point to other formulas in this range - when any of them applies, a different formula is the right specification.

 

E-700/H-190 is specified for electrical and electronic component encapsulation where the primary requirements are electrical insulation, moisture resistance, and mechanical protection - the standard suite of properties that most industrial electronic potting applications require. It is a Shore D 80 formula with 100% solid content, low shrinkage, and both room temperature and heat cure availability.

 

The applications where E-700/H-190 is appropriate are broad: control boards, sensors, coils, transformers, connectors, relays, and general electronic assemblies in indoor or industrial environments. These are applications where the components are not subject to repeated thermal cycling, the cure volume is not so large that exotherm becomes a process concern, the surface appearance of the potted assembly is not a design criterion, and the production environment has standard epoxy handling capability.

 

Where E-700/H-190 is not the correct specification: for potting configurations involving large volume pours where cure exotherm needs to be managed, E-190/H-190 is designed specifically for that condition. For assemblies that will be subject to repeated thermal cycling, vibration, or dynamic mechanical stress, E-750/H-750 Shore A 65 is the appropriate formula. For appearance-critical encapsulation or applications requiring minimal water absorption, E-132/H-100 provides the high-gloss surface and 0.06% water absorption. For production lines without heat curing equipment where RT cure is the primary pathway, E-120/H-100 is built for that condition.

 

Electrical Insulation and Moisture Resistance

The cured E-700/H-190 system provides the following electrical insulation properties:

Dielectric strength: 480 V/mil

Volume resistivity: 5 × 10¹⁵ Ω·cm

 

These values represent strong electrical insulation performance for general electronic potting. The volume resistivity of 5 × 10¹⁵ Ω·cm is among the highest in this product range - directly protecting encapsulated conductors and components from leakage current under normal service conditions.

Water absorption is 0.15% (25°C, 24 hours). This is the second-lowest water absorption value in the six-formula range - above E-132/H-100 (0.06%) and below E-750/H-750 (0.25%), E-600/H-600 (0.33%), and E-120/H-100 (0.43%). For electronic assemblies in humid environments, low water absorption reduces the amount of moisture that diffuses through the encapsulant body over time, helping to maintain the insulation properties of the cured potting over the service life.

 

E-700/H-190 provides excellent water resistance; the cured system exhibits excellent electrical characteristics and chemical resistance.

 

Cure Conditions: Room Temperature or Heat

E-700/H-190 supports two cure pathways: room temperature and heat.

Room temperature cure:

Gel time at RT: 1–5 hours

Full cure at RT: 7 days

 

Heat cure:

Gel time with heat: 50°C × 2 hours (initial gel / demold condition)

Full cure with heat: 80°C × 2 hours + 120°C × 2 hours (two-stage)

 

The published heat cure schedule is two-stage: 80°C × 2 hours followed by 120°C × 2 hours. An oven capable of reaching 120°C is required for the full heat cure schedule. If only an 80°C oven is available, room temperature cure is the alternative pathway. Actual cure behavior depends on batch size, section thickness, and ambient conditions - evaluate under your specific production conditions.

 

Pot life is 60 minutes at 25°C. As with all two-component epoxy systems, working time is affected by batch size and ambient temperature - larger batches and warmer conditions reduce the time available from mixing to pour completion.

 

Vacuum deairing of the mixed compound before pouring is recommended to achieve void-free encapsulation. Voids in the cured encapsulant reduce both the mechanical and electrical protection provided by the potting.

 

Mechanical Properties and Low Shrinkage

Cured E-700/H-190 mechanical properties:

Hardness: Shore D 80

Compressive strength: 10,000 psi

Flexural strength: 4,300 psi

Tensile strength: 11,000 psi

Shore D 80 hardness provides hard, rigid mechanical protection for potted components. The compressive and tensile strength values place E-700/H-190 in the range appropriate for industrial electronic encapsulation where the cured potting must resist handling, assembly, and in-service mechanical contact.

 

E-700/H-190 cures with low shrinkage. In electronic potting, shrinkage during cure creates internal stress on the encapsulated components. Low shrinkage reduces the mechanical load imposed on component leads, solder joints, and PCB traces during the cure process - a relevant property for assemblies with fragile components or fine-pitch connections.

 

E-700/H-190 has moderate viscosity and 100% solid content. 100% solid content means no solvent is present in the formulation - all mixed material becomes cured encapsulant, with no solvent evaporation during cure and no associated volatile organic compound (VOC) emission during the potting operation.

 

Mix Ratio, Viscosity, and Processing

E-700/H-190 is supplied as two components:

E-700 (Resin): Clear liquid, viscosity 2,000–5,500 cps at 25°C

H-190 (Hardener): Clear liquid, viscosity 50–200 cps at 25°C

 

Mix ratio is 100 parts E-700 to 40 parts H-190 by weight. Accurate weighing of both components is required before mixing - ratio error is a primary cause of incomplete cure or soft spots in the cured potting. Once weighed, thorough mixing is essential: the TDS specifies scraping the mixture on the edge of the container wall and bottom to ensure the full charge is homogeneously mixed.

 

After mixing, vacuum deairing removes air entrapped during the mixing process before the material is poured into the assembly. This step is recommended to prevent voids in the cured encapsulant.

 

Storage: store at 25°C or lower in a dry location. Shelf life in unopened original containers is 8 months. Prevent E-700 and H-190 from contaminating each other during storage - cross-contamination reduces storage life. Keep away from sunlight, high temperature, and high humidity.

 

Not Sure Which Formula Fits Your Application?

E-700/H-190 is the right answer for the majority of general electronic potting applications. If a specific condition applies - large volume, thermal cycling, appearance requirement, or no heat equipment - use the four-variable selection guide to confirm the appropriate formula.

→ Clear epoxy potting compound selection guide - four variables, six formulas

 

For cracking or delamination in existing potted assemblies: Why Potted Electronic Components Fail →

 

Manufactured in Taiwan Under IATF 16949 Quality Standards

E-700/H-190 is produced by Fong Yong Chemical Co., Ltd. at its manufacturing facility in Taiwan. Fong Yong holds IATF 16949 certification - the international quality management system standard for automotive supply chains - which governs manufacturing processes, incoming material controls, traceability, and quality documentation across its resin production operations.

 

For procurement teams qualifying a long-term standard epoxy potting supplier for recurring electronic assembly production, the relevant question is not only whether a formula meets the datasheet specification on first order, but whether batch-to-batch consistency is maintained at production volumes. E-700/H-190 is a general-purpose formula specified precisely because it is the reliable standard - and that reliability depends on the manufacturing quality system behind it. IATF 16949 certification means the processes, incoming material controls, and production documentation producing E-700/H-190 are subject to the same audit-ready quality standards applied across Fong Yong's full resin production operations. For supply chain teams where manufacturer quality certification is a vendor qualification criterion, this provides the manufacturer-level documentation foundation required.

 

Fong Yong has manufactured epoxy resin and potting compound systems in Taiwan for over 40 years. Technical data sheets, batch documentation, and application engineering support are available on request.

 

Work With Fong Yong's Technical Team

Request a sample, obtain TDS documentation, get a quotation, or discuss your application with our engineering team.

Request Sample / TDS → Request Quotation → Technical Support →

 

Related Knowledge

How to Select a Clear Epoxy Potting Compound for Electronic Components: Four Variables That Determine the Right Formula

Why Potted Electronic Components Fail: Cracking, Delamination, and Moisture Ingress

Does Your Production Line Really Need an Oven? Room Temperature vs Heat Cure in Electronic Potting Epoxy

 

Technical content prepared by: Fong Yong Chemical Co., Ltd. Technical Team | Source: TDS E-700/H-190, revision 2016/10/24

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