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- 2F. No.216-2, Zhongzheng Rd., Shulin Dist., New Taipei City 238, Taiwan
- fong.yong01@msa.hinet.net
- +886-2-26824939
Single Part Thermally Conductive Epoxy EncapsulantFong Yong EP-10C#7-BK is an one component, thermal curing epoxy adhesive for bonding, sealing, coating and encapsulation. It exhibits excellent physical properties, excellent electrical insulation
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Low-Stress Epoxy Potting For Stress-Sensitive Electronics...E-768 / H-768 is a soft, low-stress epoxy potting system designed to protect delicate electronic components without inducing cracking, solder fatigue, or curing stress. Ideal for stress-sensitive
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Flexible Epoxy Potting Compound Engineered Against Stress...E759 H759 semi-flexible epoxy potting compound designed for controlled stress distribution and system interaction. Taiwan manufacturer supporting bulk, wholesale, and customized supply.
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Electrically Conductive Epoxy AdhesiveEP-1109-11 is a one-component, black, low halogen carbon-filled electrically conductive epoxy adhesive.
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Non Sag Epoxy Encapsulation GlueE-226/H-2 is a two-component, solvent-free epoxy adhesive. The base resin component is thixotropic and contains a low-viscosity liquid hardener.
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Thermal Transfer Electronic Potting Epoxy AdhesiveE-590B-1/H-590 is a two-component, pourable, black, hard, thermally conductive epoxy potting compound.
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AB Liquid Epoxy Resin for Potting Circuit BoardsE-768/H-768 is a two-component, flexible, room temperature curing epoxy resin and curing agent. It is specially designed for the requirements of low temperature operation.
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5 Minutes Epoxy Bonding AdhesiveFong Yong 5 minutes epoxy bonding adhesive E-906/H-906 is a two-component adhesive composed of epoxy resin and hardener.
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Electronic Potting Epoxy Resin | E-700/H-190 | Shore D 80...E-700/H-190 electronic potting epoxy resin. Shore D 80, 480 V/mil dielectric strength. RT or two-stage heat cure. Standard encapsulant for electronics.
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Flame-Retardant Epoxy Potting for Transformers|Applicatio...Learn why flame-retardant epoxy potting is commonly used in transformer applications. This application overview explains thermal, electrical, and fire-safety design considerations without product
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Flexible Epoxy Resin Potting CompoundFong Yong E759/H759 is a A/B component, ambient temperature cure, flame-retardant UL-94v0 modified epoxy resin, widely used on electronic potting, encapsulating and casting.
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Low-Exotherm Clear Epoxy Potting Compound for Large Elect...E-190/H-190 is a low-exotherm clear epoxy for large-component potting. Shore D 80, Tg 75°C, service temperature -30°C to +90°C. RT or heat cure (80°C × 2 hrs). Two mix ratio options.
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