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High Temp Encapsulation Epoxy Resin

Name: Customized High Temp Encapsulation Epoxy Resin Suppliers, Manufacturers, Factory - FONG YONG
Brand: Fong Yong
SKU: 165729320

E532-1A(D)/H532-1B(D) is a two-part, fast cure, flammable retardant UL-94vo epoxy adhesive compound that cures at room temperature.

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Description

Fong Yong Chemical Co., Ltd. is one of the leading manufacturers and suppliers of high temp encapsulation epoxy resin in Taiwan. With abundant experience, we warmly welcome you to buy high quality customized products at competitive price from our factory. If you have any enquiry about quotation, please feel free to email us.

E532-1A(D)/H532-1B(D)

High temp encapsulation epoxy resin

E532-1A(D)/H532-1B(D) is a two-part, fast cure, flammable retardant UL-94vo epoxy adhesive compound that cures at room temperature. Mainly used in the encapsulation of small electronic parts, or the bonding of electronic components that require high temperature resistance as well as flammable retardant grade. This 2:1 mixing ratio glob top epoxy glue has excellent moisture resistance and electrical insulation. After fully cured, the hardness of the high temp encapsulation epoxy resin is very high, reaching about Shore D 90. Heating the fully cured epoxy resin at 300℃ for around 2 minutes, the cured compound cannot be completely removed. It is very helpful for protecting the intellectual property on the chip.

Prices:

Our quotation will be adjusted according to changes in raw material costs and exchange rates. Please leave your contact information. We will provide our best price as soon as possible after receiving your inquiry.

Product properties:

Features:

1. Wide service temperature range.

2. Contains no solvents.

3. Excellent electrical properties.

4. Thermal cycling stability.

5. Excellent electrical insulation

Product advantages:

1. Great intellectual property defense: the cured epoxy hides parts and defies removal attempts.

2. UL 94V-0 for flame resistance.

3. IATF 16949 certified.

Applications:

1. For bonding, sealing and coating on electronic components which require flammable retardant and high temperature resistance.

2. Glob top encapsulant for environmental protection and boosting the mechanical strength of wire bonded devices.

FAQ:

Questions:	Answers:
Why are chips covered in epoxy?	In "wire bonding", the chip is attached to the board with an adhesive. ... In all cases, the chip and connections are covered with an encapsulant to reduce entry of moisture or corrosive gases to the chip, to protect the wire bonds or tape leads from physical damage, and to help dissipate heat.
What is glob topping?	Glob tops are usually epoxies that are dispensed to cover a single chip in chip-on- board (COB) applications.
Is the epoxy waterproof?	Epoxy is its ability to seal and form a waterproof (and anti-corrosive) layer of protection.