Contact Us
- 2F. No.216-2, Zhongzheng Rd., Shulin Dist., New Taipei City 238, Taiwan
- fong.yong01@msa.hinet.net
- +886-2-26824939
-
04/May
2026
How Rigid Epoxy Potting Causes the Failures It Was Selected to Prevent — Stre...
A rigid high-modulus epoxy potting compound transfers cure shrinkage and thermal cycling stress directly into wire bonds, solder joints, and mixed-CTE interfaces. Engineering analy
-
08/Feb
2026
Engineering Validation Responsibilities in PU Doming: Ambient Cure vs Control...
Page Overview Once curing strategy is selected in PU doming, engineering responsibility is implicitly assigned -either to environmental stability or to process execution. This arti
-
07/Feb
2026
Why Some PU Doming Systems Are Intentionally Not Room-Temperature Curable
Page Overview In PU doming applications, room-temperature curing is often perceived as the simplest and most practical option. However, from an engineering perspective, curing conv
-
06/Feb
2026
Flame-Retardant Epoxy Potting: Design Considerations
Figure 1. Flame-retardant epoxy potting is often specified to support UL 94 V-0 fire-performance targets, but end-product compliance and long-term reliability depend on geometry, p
-
30/Jan
2026
How Low-Stress Epoxy Potting Prevents Component Cracking in Sensitive Electro...
Figure 1. Low-stress epoxy potting gently absorbs internal stress around sensitive electronic components. Introduction In modern electronic assemblies, long-term reliability issues
-
06/Jan
2026
Mitigating Vibration-Induced Dielectric Failure in High-Voltage Power Supplies
Vibration-induced mechanical stress is a hidden cause of dielectric degradation in high-voltage power supplies. This article explains how vibration affects insulation reliability a