Home > Products > Epoxy Resin > Epoxy Potting Compound

Products

Thermal Transfer Electronic Potting Epoxy Adhesive

Name: Customized Thermal Transfer Electronic Potting Epoxy Adhesive Suppliers, Manufacturers, Factory - Wholesale Quotation - FONG YONG
Brand: Fong Yong
SKU: 165729736

E-590B-1/H-590 is a two-component, pourable, black, hard, thermally conductive epoxy potting compound.

Send Inquiry

Description

Fong Yong Chemical Co., Ltd. is one of the leading manufacturers and suppliers of thermal transfer electronic potting epoxy adhesive in Taiwan. Welcome to wholesale bulk customized thermal transfer electronic potting epoxy adhesive at low price from our factory. If you have any enquiry about quotation and free sample, please feel free to email us.

E-590-BK-1/H-590

Thermal transfer electronic potting epoxy adhesive

E-590B-1/H-590 is a two-component, pourable, black, hard, thermally conductive epoxy potting compound. It is specially developed for applications that require high temperature resistance (reference use temperature is about -20°C~+100°C) and heat conduction. Proper thermal management is essential for the development of smaller and lighter power electronic devices. The epoxy retains excellent characteristics throughout thermal cycling. This thermal transfer electronic potting epoxy adhesive has been widely used in a variety of applications to protect sensitive electronic components from overheating, such as a thin adhesive layer of thermally conductive adhesives, used to connect semiconductors to heat sinks, and as low-viscosity potting and casting products for applications that require thermal conductivity and high temperature resistance. It provides mechanical and physical protection for printed circuit boards and electronic components in extreme environments. Without protection, electronic components may be damaged by moisture, corrosion, and extreme temperatures. Our thermally conductive potting compound can achieve uniform heat distribution and prevent overheating and short circuits.

Prices:

Our quotation will be adjusted according to changes in raw material costs and exchange rates. Please leave your contact information. We will provide our best price as soon as possible after receiving your inquiry.

Product properties:

Features:

1. Available for cure at ambient temperature or elevated temperature.

2. Good chemical and water resistance.

3. 100% solids.

Product advantages:

1. IATF 16949 certified.

2. Low shrinkage after cure.

3. Moderate and slowly exothermic during cure process. When applying on larger components, chemical reaction of this epoxy won’t be too aggressive and won’t cause deforming or cracking.

Applications:

1. Ideal for the potting and encapsulation of many heat-sensitive or delicate components such as glass diodes and sensors, as well as for transformers, coils, chokes, relays, and more.

2. Ideal for applications requiring a thermally conductive epoxy with resistance to solvents and chemicals.

FAQ:

Questions:	Answers:
Does epoxy need air to dry?	Generally, epoxy cures faster when the air temperature is warmer. Exothermic heat is produced by the chemical reaction that cures epoxy. ... The thinner the layer of curing epoxy, the less it is affected by exothermic heat, and the slower it cures.
Can I use plastic cups to mix epoxy resin?	Always use hard plastic containers to mix your epoxy resin in. Epoxy resin doesn't stick to plastic, which makes these mixing vessels super easy to clean AND re-usable! Wearing gloves, wipe out any excess resin from the sides and bottom of your mixing vessel with paper towel.
Can I add more Hardener ( PART B) to speed up the curing process?	No. Ratio instructions must be strictly observed. Improper mixing or inaccurate weight prevent the chemical reaction between molecules in Part A and molecules in Part B (polymerization) to occur correctly. The molecular structure is affected and consequently, your resin will remain sticky, or it will not cure in some places.

Our company information:

Established in 1983, Fong Yong Chemical Co., Ltd. is one of the leading manufacturers and suppliers of a wide range of electronic potting compounds, casting compounds, transparent clear coating compounds, 3D sticker doming resins, structure adhesives, sealants, flooring coating compounds… for electrical insulation, water resistance, heat transfer, surface protection, product value added, bonding, laminating... We have formulated, manufactured and supplied modified epoxy resin, polyurethane resin, liquid silicone rubber, UV cure glue, thermal conductive paste/adhesive, water base polyurethane coatings, structure adhesives... for more than hundred items globally. Our products are designed and manufactured in compliance with international standards using best quality raw material. The entire product range is available in standard specifications. Further, customized products are also available.

Professional manufacturer of heat conductive epoxy potting compound