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18/Aug
2026
Why Potted Electronic Components Fail: Cracking, Delamination, and Moisture I...
Most potted electronic component failures trace back to one of four mechanisms: thermal stress cracking, interface delamination, moisture ingress, or cure-time exothermic overstres
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12/Jun
2026
Why Clear Epoxy Castings Crack, Yellow, or Warp After Pouring — The Exotherm ...
A clear epoxy casting that looked perfect in the mold can emerge cracked, yellowed, or warped — and the defect that appeared after curing was already determined during curing, not
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02/Jun
2026
Why Rigid Clear Coatings Fail on Mixed-Material Decorative Products
Rigid clear coatings fail on mixed-material decorative products not because of poor adhesion — but because the substrates move. Leather flexes with every handling cycle. Wood and b
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04/May
2026
Delayed Cracking in Epoxy-Potted Assemblies: The Residual Stress Mechanism Th...
Thick-section epoxy potting cured in a single high-temperature stage develops locked-in residual tensile stress from core exotherm overshoot. The assembly passes initial testing an
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30/Apr
2026
Delayed Cracking in Epoxy-Potted Assemblies: The Residual Stress Mechanism Th...
Thick-section epoxy potting cured in a single high-temperature stage develops locked-in residual tensile stress from core exotherm overshoot. The assembly passes initial testing an
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13/Jan
2026
Vibration-Induced Dielectric Failure in High-Voltage Electronics: Failure Mec...
Page Introduction Mechanical vibration is often treated as a secondary concern in high-voltage electronics design. However, field failures across automotive, industrial, and energy