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04/May
2026
Delayed Cracking in Epoxy-Potted Assemblies: The Residual Stress Mechanism Th...
Thick-section epoxy potting cured in a single high-temperature stage develops locked-in residual tensile stress from core exotherm overshoot. The assembly passes initial testing an
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30/Apr
2026
Delayed Cracking in Epoxy-Potted Assemblies: The Residual Stress Mechanism Th...
Thick-section epoxy potting cured in a single high-temperature stage develops locked-in residual tensile stress from core exotherm overshoot. The assembly passes initial testing an
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13/Jan
2026
Vibration-Induced Dielectric Failure in High-Voltage Electronics: Failure Mec...
Page Introduction Mechanical vibration is often treated as a secondary concern in high-voltage electronics design. However, field failures across automotive, industrial, and energy