LED Encapsulation Epoxy Resin — 140°C Heat Resistance, High Transparency | E-600 / H-600 | Fong Yong

Fong Yong Chemical Co., Ltd. is one of the leading manufacturers and suppliers of led encapsulation epoxy resin — 140°c heat resistance, high transparency | e-600 / h-600 | fong yong in Taiwan. With abundant experience, we warmly welcome you to buy high quality customized products at competitive price from our factory. If you have any enquiry about quotation, please feel free to email us.

 

What Is E-600/H-600?

E-600/H-600 is a two-component, heat-cure clear epoxy resin for LED encapsulation, manufactured by Fong Yong Chemical Co., Ltd., an IATF 16949 certified manufacturer, in Taiwan. It is the only formula in the Fong Yong clear potting range with a published refractive index (1.534 as measured) and the only one rated for 140–150°C continuous service - making it the correct specification for high-power LED modules, luminaire assemblies, and optical LED designs where encapsulant thermal performance and refractive index compatibility are specification requirements. Heat cure is required; there is no room-temperature cure option. Mix ratio is 3:1 (E-600 resin : H-600 hardener) by weight. Cure schedule: 100°C × 6 hours (single-stage), or 75°C × 2–3 hours followed by 100°C × 5 hours (two-stage). Pot life 8 hours at 25°C. Fully cured: Shore D 90, dielectric strength 20 KV/mm, volume resistivity 1.5×10¹⁶ Ω·cm, water absorption 0.33%.

 

Ready to evaluate E-600 / H-600?Request Sample / TDS →Request Quotation →

 

Standard electronic potting compounds protect components from moisture and electrical hazards. LED encapsulation must also preserve optical performance under sustained thermal load. When the encapsulant becomes part of the optical path and operates under continuous heat from LED junction temperatures, service temperature, refractive index, and optical stability become engineering specifications - not optional features.

E-600/H-600 is the heat-cure LED encapsulation epoxy resin in the Fong Yong clear potting range. It is the only formula in this product family combining a mandatory heat-cure process, a published refractive index, and a 140–150°C service rating.

 

Choose E-600/H-600 When:

The assembly operates at sustained temperatures above 100°C - LED fixtures, high-power lighting modules, or heat-generating electronics requiring 140–150°C rated encapsulation

A heat cure step at 100°C is already part of your production process or oven capacity is available

Refractive index 1.534 compatibility with optical components is a design specification

 

Where E-600/H-600 Is Specified

E-600/H-600 is specified where the operating temperature of the finished assembly exceeds what standard rigid potting compounds are designed to handle, and where high transparency of the encapsulant is a functional - not merely aesthetic - requirement.

 

Primary applications include:

LED modules and luminaire assemblies requiring encapsulation rated for 140–150°C service

High-power LED drivers and LED PCB assemblies where junction temperatures during operation generate sustained thermal load on the encapsulant

Electronic and electrical components requiring high-transparency casting where a heat cure process is in place

Assemblies where refractive index 1.534 is specified for optical compatibility with LED lenses or covers

E-600/H-600 requires a heat cure step - oven capacity at 100°C must be available in the production process.

 

Typical LED Design Scenarios

Application	Why E-600/H-600
COB LED Module	Encapsulant under sustained junction thermal load - 140°C service rating required
High-Bay / Industrial Lighting	Continuous high-power operation; 140–150°C rated encapsulation
Optical LED Assembly	Published refractive index 1.534 for optical design qualification

 

Why LED Encapsulation Requires a Dedicated Formula

Standard epoxy potting compounds in this product range are formulated for general electronic service conditions: indoor environments, protection from moisture and electrical hazards, and moderate thermal exposure. They cure at room temperature or with mild heat, and their service temperature ratings reflect typical electronic component operating ranges.

 

LED encapsulation imposes requirements that general-purpose formulas do not address:

Thermal load during operation. LED junction temperatures during operation can reach 80–120°C at the chip level, and the encapsulant in direct contact with the LED is continuously exposed to this heat. A formula intended for standard electronic service conditions may not retain the same mechanical or optical performance when subjected to sustained LED operating temperatures. E-600/H-600 is rated for 140–150°C continuous service - providing margin above LED operating conditions.

 

Transparency durability. Encapsulants that are clear at room temperature may yellow or haze over time under UV exposure and thermal cycling. E-600/H-600 provides excellent weather resistance and crack resistance. Suitability for specific LED operating environments - including long-term transparency under sustained LED operating temperatures - should be verified under actual service conditions.

 

Heat cure as a design consideration. E-600/H-600 requires heat cure - there is no room temperature cure option. The cure schedule is 100°C × 6 hours, or a two-stage process of 75°C × 2–3 hours followed by 100°C × 5 hours. For production lines with oven capacity already in use for other processes, this integrates directly.

 

The 8-hour pot life at 25°C provides extended working time that accommodates larger batch sizes, metered dispensing systems, and production schedules where mix-and-hold time between preparation and application is a practical consideration.

 

140–150°C Heat Resistance: What This Means for LED Operating Conditions

For LED applications, the 140–150°C service temperature rating matters because encapsulant performance must be evaluated under the thermal conditions present during actual LED operation, not just ambient storage temperature. A high-power LED fixture operating at rated current will maintain a junction temperature substantially above ambient. The encapsulant in contact with the LED substrate experiences that temperature continuously during operation.

 

The 140–150°C service temperature rating means the cured encapsulant maintains its structural integrity while maintaining the encapsulation function expected from its published service-temperature rating. The property values listed in the specifications - Shore D 90 hardness, dielectric strength 20 KV/mm, volume resistivity 1.5×10¹⁶ Ω·cm - are measured at 25°C per standard test conditions. For applications where property retention at elevated operating temperature must be quantified, testing under actual service conditions is required.

 

The heat cure requirement (100°C × 6 hours) is directly related to this thermal performance. The cure conditions establish the crosslink density that gives the cured system its 140–150°C service capability. A formula that cures at room temperature cannot develop the same thermal resistance - which is why E-600/H-600 is the only formula in this range with both mandatory heat cure and 140°C+ service rating.

 

High Transparency and Refractive Index 1.534

A published refractive index allows optical designers to evaluate encapsulant compatibility with LED chips, lenses, and existing production specifications - and to confirm whether a material change will affect light extraction efficiency. E-600/H-600 cures to a high transparency encapsulant after cure under the published cure schedule, and carries a refractive index of 1.534 as measured. It is the only formula in the Fong Yong clear potting range with a published refractive index specification.

 

Refractive index determines how light bends at the interface between the cured epoxy and adjacent materials - the LED chip surface, lens, or cover. In LED encapsulation, the refractive index mismatch between the LED chip semiconductor and the surrounding material determines how much light is lost to internal reflection (Fresnel loss) rather than transmitted. An encapsulant with a documented refractive index value enables optical design evaluation; without it, material qualification for LED applications cannot be completed on a documented basis.

 

Most LED customers do not specify 1.534 as a procurement requirement - they need to know whether the encapsulant will reduce light loss and whether its optical properties are consistent enough for production qualification. E-600/H-600's published value provides the documented basis for that evaluation. Where LED design specifications do not include a refractive index requirement, this property does not affect the selection decision.

 

Electrical Insulation and Environmental Protection

E-600/H-600 provides the following electrical insulation properties:

Dielectric strength: 20 KV/mm

Volume resistivity: 1.5×10¹⁶ Ω·cm

 

These values apply to the cured system tested under laboratory conditions at 25°C. For LED assemblies operating at elevated temperature, the electrical insulation performance at operating temperature is the relevant specification - confirm testing requirements with your design team.

Environmental protection: E-600/H-600 provides moisture and weather resistance as a cured encapsulant. E-600/H-600 provides excellent weather resistance and crack resistance. Suitability for outdoor LED fixture applications - including IP rating requirements, long-term UV exposure, and thermal cycling over the installation's service life - should be verified under the actual environmental conditions of the specific installation. Water absorption is 0.33% (25°C × 24hr).

 

Shore D 90 hardness supports the structural integrity of potted LED assemblies and resistance to mechanical impact.

 

High Heat Resistant Epoxy Encapsulant for Electronics - Taiwan Manufacturer

E-600/H-600 is a high heat resistant epoxy encapsulant for electronics manufactured by Fong Yong Chemical Co., Ltd. in Taiwan. Its 140–150°C continuous service temperature rating positions it as one of the highest-rated clear epoxy potting compounds available for electronic encapsulation - specifically engineered for LED modules, power electronics, and high-temperature assemblies where the encapsulant must maintain structural and optical integrity under sustained thermal load from LED junction temperatures or component heat dissipation.

 

For procurement teams sourcing a high heat resistant epoxy encapsulant from a Taiwan manufacturer, E-600/H-600 provides a combination that few comparable products offer: documented 140–150°C service performance, published refractive index (1.534) for optical qualification, and manufacturing under IATF 16949-certified quality controls. Technical data sheets, sample requests, and application engineering inquiries are handled directly by Fong Yong's technical team in Taiwan.

 

Not Sure Which Formula Your LED Application Needs?

Not sure whether your LED application requires a dedicated LED encapsulation epoxy? Start with the selection guide - it routes each application requirement to the appropriate formula across all six products in this range:

→ Compare all clear epoxy potting compounds - selection guide for electronic components

 

Manufactured in Taiwan Under IATF 16949 Quality Standards

E-600/H-600 is produced by Fong Yong Chemical Co., Ltd. at its manufacturing facility in Taiwan. Fong Yong holds IATF 16949 certification - the international quality management system standard for automotive supply chains - which governs manufacturing processes, incoming material controls, traceability, and quality documentation across its resin production operations.

 

Procurement teams specifying E-600/H-600 by refractive index (1.534) and service temperature (140–150°C) are already working from a document-driven qualification process. The same discipline that drives refractive index documentation in the material datasheet applies to the manufacturer: IATF 16949 certification means the processes producing E-600/H-600 are subject to audit-ready quality controls and batch traceability. For LED component supply chains - particularly where the encapsulant is part of an optical or thermal specification - manufacturer-level quality documentation supports the same requirements that make a published refractive index necessary in the first place.

 

Fong Yong has manufactured epoxy resin systems in Taiwan for over 40 years. Technical data sheets, batch documentation, and application engineering support are available on request.

 

Work With Fong Yong's Technical Team

Request a sample, obtain TDS documentation, get a quotation, or discuss your application with our engineering team.

Request Sample / TDS → Request Quotation → Technical Support →

 

Related Knowledge

How to Select a Clear Epoxy Potting Compound for Electronic Components: Four Variables That Determine the Right Formula

Does Your Production Line Really Need an Oven? Room Temperature vs. Heat Cure in Electronic Potting Epoxy

 

Technical content prepared by: Fong Yong Chemical Co., Ltd. Technical Team | Source: TDS E-600/H-600

Hot Tags: led encapsulation epoxy resin — 140°c heat resistance, high transparency | e-600 / h-600 | fong yong, suppliers, manufacturers, factory, customized, Clear Epoxy, Clear Epoxy for Making River Table, Clear Flexible Sticker Doming Epoxy Resin, Hard Clear Epoxy for Carbon Fiberglass, Self Leveling Clear Doming Epoxy Resin, UV Resistant Clear Epoxy Resin