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AB Liquid Epoxy Resin for Potting Circuit BoardsE-768/H-768 is a two-component, flexible, room temperature curing epoxy resin and curing agent. It is specially designed for the requirements of low temperature operation.
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Room-Temperature-Cure Clear Epoxy Potting Compound | E-12...E-120/H-100 cures fully at room temperature — no oven or heating equipment required. Shore D 82, flexural strength 13,000 psi, low exotherm that will not harm electronic components. Clear
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Low-Stress Epoxy Potting For Stress-Sensitive Electronics...E-768 / H-768 is a soft, low-stress epoxy potting system designed to protect delicate electronic components without inducing cracking, solder fatigue, or curing stress. Ideal for stress-sensitive
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What Is Epoxy Resin? Material Fundamentals, Limitations, ...An engineering overview of epoxy potting compounds for electronics encapsulation. Compare cure options, rigidity, and production considerations, and navigate to product-specific pages for validation.
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Electrically Conductive Epoxy AdhesiveEP-1109-11 is a one-component, black, low halogen carbon-filled electrically conductive epoxy adhesive.
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Non Sag Epoxy Encapsulation GlueE-226/H-2 is a two-component, solvent-free epoxy adhesive. The base resin component is thixotropic and contains a low-viscosity liquid hardener.
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Thermal Transfer Electronic Potting Epoxy AdhesiveE-590B-1/H-590 is a two-component, pourable, black, hard, thermally conductive epoxy potting compound.
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5 Minutes Epoxy Bonding AdhesiveFong Yong 5 minutes epoxy bonding adhesive E-906/H-906 is a two-component adhesive composed of epoxy resin and hardener.
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Flame-Retardant Epoxy Potting for Transformers|Applicatio...Learn why flame-retardant epoxy potting is commonly used in transformer applications. This application overview explains thermal, electrical, and fire-safety design considerations without product
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Flexible Clear Epoxy Potting Compound for Thermal Cycling...E-750/H-750 is a Shore A 65 flexible epoxy potting compound that accommodates thermal expansion mismatch. Service temperature -30°C to +80°C. 1:1 mix ratio. RT or heat cure.
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Epoxy Potting Compound — UL94 V-0, Two-Stage Cure, HDT 13...E536/H536 is a flame-retardant 2-part epoxy potting compound designed for rigid encapsulation, thick-section stability, and long pot life processing. Made-to-order supply from Taiwan.E536/H536 is a
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Single Part Thermally Conductive Epoxy EncapsulantFong Yong EP-10C#7-BK is an one component, thermal curing epoxy adhesive for bonding, sealing, coating and encapsulation. It exhibits excellent physical properties, excellent electrical insulation
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