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Electrically Conductive Epoxy AdhesiveEP-1109-11 is a one-component, black, low halogen carbon-filled electrically conductive epoxy adhesive.
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E-533/H-533 Thermally Conductive Epoxy Potting Compound |...Fong Yong E-533/H-533: 1.5 W/m·K thermally conductive epoxy potting compound. Tg 127°C, Shore D 88, 24-hr pot life. Meets UL94 V-0 grade (E120665). Heat cure. Made in Taiwan.
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Low-Stress Epoxy Potting For Stress-Sensitive Electronics...E-768 / H-768 is a soft, low-stress epoxy potting system designed to protect delicate electronic components without inducing cracking, solder fatigue, or curing stress. Ideal for stress-sensitive
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What Is Epoxy Resin? Material Fundamentals, Limitations, ...An engineering overview of epoxy potting compounds for electronics encapsulation. Compare cure options, rigidity, and production considerations, and navigate to product-specific pages for validation.
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Non Sag Epoxy Encapsulation GlueE-226/H-2 is a two-component, solvent-free epoxy adhesive. The base resin component is thixotropic and contains a low-viscosity liquid hardener.
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High Temp Encapsulation Epoxy ResinE532-1A(D)/H532-1B(D) is a two-part, fast cure, flammable retardant UL-94vo epoxy adhesive compound that cures at room temperature.
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Electronic Potting Epoxy Resin | E-700/H-190 | Shore D 80...E-700/H-190 electronic potting epoxy resin. Shore D 80, 480 V/mil dielectric strength. RT or two-stage heat cure. Standard encapsulant for electronics.
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Flame-Retardant Epoxy Potting for Transformers|Applicatio...Learn why flame-retardant epoxy potting is commonly used in transformer applications. This application overview explains thermal, electrical, and fire-safety design considerations without product
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Flexible Epoxy Resin Potting CompoundFong Yong E759/H759 is a A/B component, ambient temperature cure, flame-retardant UL-94v0 modified epoxy resin, widely used on electronic potting, encapsulating and casting.
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Epoxy Potting Compound — UL94 V-0, Two-Stage Cure, HDT 13...E536/H536 is a flame-retardant 2-part epoxy potting compound designed for rigid encapsulation, thick-section stability, and long pot life processing. Made-to-order supply from Taiwan.E536/H536 is a
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Low-Exotherm Clear Epoxy Potting Compound for Large Elect...E-190/H-190 is a low-exotherm clear epoxy for large-component potting. Shore D 80, Tg 75°C, service temperature -30°C to +90°C. RT or heat cure (80°C × 2 hrs). Two mix ratio options.
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Single Part Thermally Conductive Epoxy EncapsulantFong Yong EP-10C#7-BK is an one component, thermal curing epoxy adhesive for bonding, sealing, coating and encapsulation. It exhibits excellent physical properties, excellent electrical insulation
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