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Electrically Conductive Epoxy AdhesiveEP-1109-11 is a one-component, black, low halogen carbon-filled electrically conductive epoxy adhesive.
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High Thermal Conductivity Epoxy Potting Compound — 1.5 W/...E533/H533 delivers 1.5 W/m·K thermal conductivity and Tg 127°C for thick-section power electronics potting where heat accumulation causes component failure. Heat cure required. NOTE: UL follow-up
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Low-Stress Epoxy Potting For Stress-Sensitive Electronics...E-768 / H-768 is a soft, low-stress epoxy potting system designed to protect delicate electronic components without inducing cracking, solder fatigue, or curing stress. Ideal for stress-sensitive
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Flexible Epoxy Potting Compound Engineered Against Stress...E759 H759 semi-flexible epoxy potting compound designed for controlled stress distribution and system interaction. Taiwan manufacturer supporting bulk, wholesale, and customized supply.
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Epoxy Potting Compound — UL94 V-0, Flexible Cure Schedule...E532/H532 is a UL94 V-0 flame-retardant epoxy potting compound engineered for production environments where cure schedule flexibility is required. Accepts RT or heat-accelerated cure. UL File
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What Is Epoxy Resin? Material Fundamentals, Limitations, ...An engineering overview of epoxy potting compounds for electronics encapsulation. Compare cure options, rigidity, and production considerations, and navigate to product-specific pages for validation.
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Non Sag Epoxy Encapsulation GlueE-226/H-2 is a two-component, solvent-free epoxy adhesive. The base resin component is thixotropic and contains a low-viscosity liquid hardener.
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5 Minutes Epoxy Bonding AdhesiveFong Yong 5 minutes epoxy bonding adhesive E-906/H-906 is a two-component adhesive composed of epoxy resin and hardener.
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Electrical Casting Potting Epoxy ResinE-132/H-100 is a fast curing, low viscosity epoxy resin. It is an electronic/electrical grade epoxy potting compound, which is mainly used for potting, encapsulation, and casting to achieve
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Flame-Retardant Epoxy Potting for Transformers|Applicatio...Learn why flame-retardant epoxy potting is commonly used in transformer applications. This application overview explains thermal, electrical, and fire-safety design considerations without product
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Flexible Epoxy Resin Potting CompoundFong Yong E759/H759 is a A/B component, ambient temperature cure, flame-retardant UL-94v0 modified epoxy resin, widely used on electronic potting, encapsulating and casting.
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Flexible Electronic Potting Epoxy ResinE-750/H-750 1:1 Epoxy Potting and Encapsulating Compound is a two-component, flowable, electronic-grade compound that provides excellent physical, chemical, and electrical protection.
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