2 Part Epoxy Potting Compound Manufacturers Factory Suppliers

E536/H536 is a flame-retardant 2-part epoxy potting compound designed for rigid encapsulation, thick-section stability, and long pot life processing. Made-to-order supply from Taiwan.E536/H536 is a

E-120/H-100 cures fully at room temperature — no oven or heating equipment required. Shore D 82, flexural strength 13,000 psi, low exotherm that will not harm electronic components. Clear

E532/H532 is a UL94 V-0 flame-retardant epoxy potting compound engineered for production environments where cure schedule flexibility is required. Accepts RT or heat-accelerated cure. UL File

An engineering overview of epoxy potting compounds for electronics encapsulation. Compare cure options, rigidity, and production considerations, and navigate to product-specific pages for validation.

EP-1109-11 is a one-component, black, low halogen carbon-filled electrically conductive epoxy adhesive.

E-590B-1/H-590 is a two-component, pourable, black, hard, thermally conductive epoxy potting compound.

E532-1A(D)/H532-1B(D) is a two-part, fast cure, flammable retardant UL-94vo epoxy adhesive compound that cures at room temperature.

E-768/H-768 is a two-component, flexible, room temperature curing epoxy resin and curing agent. It is specially designed for the requirements of low temperature operation.

E-700/H-190 electronic potting epoxy resin. Shore D 80, 480 V/mil dielectric strength. RT or two-stage heat cure. Standard encapsulant for electronics.

E-750/H-750 is a Shore A 65 flexible epoxy potting compound that accommodates thermal expansion mismatch. Service temperature -30°C to +80°C. 1:1 mix ratio. RT or heat cure.

E-190/H-190 is a low-exotherm clear epoxy for large-component potting. Shore D 80, Tg 75°C, service temperature -30°C to +90°C. RT or heat cure (80°C × 2 hrs). Two mix ratio options.

Fong Yong EP-10C#7-BK is an one component, thermal curing epoxy adhesive for bonding, sealing, coating and encapsulation. It exhibits excellent physical properties, excellent electrical insulation