Flame Retardant Heatsink Compound Manufacturers Factory Suppliers

STG-716 is positioned for design scenarios where thermal interface materials may be evaluated as part of a broader safety or fire-risk review.This page focuses on how flame-retardant thermal grease

STG-716 combines 2.2 W/m·K thermal conductivity with UL 94 V-0 flame classification — for engineers where fire-risk compliance and heat dissipation cannot be treated as separate decisions. TDS and UL

SFY-368 Thermal Putty – High-performance gap-filling thermal interface material (TIM) with 3.5 W/m·K thermal conductivity, low thermal impedance, and broad operating temperature (-50°C to 200°C).

SFY‑505 delivers ultra‑high thermal conductivity above 5 W/mK, engineered for high‑heat CPUs, GPUs, and automotive electronics. Certified to IATF‑16949 standards, it ensures rapid heat dissipation,

STG-4W is a non-curing, 4 Watt/mK thermal interface material (TIM). This thermal grease is inserted between a heating device (such as an CPU) and a heat sink (such as a radiator) to transfer more