High-Gloss Clear Epoxy Potting Compound | E-132/H-100 | Fong Yong

Fong Yong Chemical Co., Ltd. is one of the leading manufacturers and suppliers of high-gloss clear epoxy potting compound | e-132/h-100 | fong yong in Taiwan. With abundant experience, we warmly welcome you to buy high quality customized products at competitive price from our factory. If you have any enquiry about quotation, please feel free to email us.

 

What Is E-132/H-100?

E-132/H-100 is a two-component, 100%-solids clear epoxy potting compound manufactured by Fong Yong Chemical Co., Ltd., an IATF 16949 certified manufacturer, in Taiwan, specified for electronic assemblies where the appearance quality of the cured surface is a product requirement. It cures to a high-gloss, blush-resistant, non-foggy surface - the lowest water absorption (0.06%) in the Fong Yong clear potting range - and is also used as a decorative or protective surface coating over circuit boards and metal panels. Mix ratio is 3:1 (E-132 resin to H-100 hardener) by weight. Fully cured (80°C × 2 hours or 7 days at room temperature): Shore D 80 hardness, 12,000 psi tensile strength, 11,000 psi flexural strength, 11,000 psi compressive strength, 7.0% elongation.

 

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E-132/H-100 is a two-component, non-volatile clear epoxy resin for electronic component encapsulation where the appearance quality of the cured surface is a product specification - not a secondary consideration. It cures to a high-gloss, non-foggy surface that resists blushing, delivers Shore D 80 hardness with 12,000 psi tensile strength, and carries the lowest water absorption in the Fong Yong clear potting range at 0.06%. The same surface quality and toughness also make it suitable as a protective or decorative surface coating over metal panels, circuit boards, and similar substrates.

 

E-132/H-100 Is the Right Specification When:

• The finished assembly is visible and the surface appearance of the cured encapsulant is a product quality criterion - high gloss, non-foggy finish required
• Minimum water absorption through the encapsulant is a specification requirement - 0.06% is the lowest value in this range
• Good adhesion to a range of metal and plastic substrate materials is required

 

If appearance quality is not a requirement and general-purpose electrical encapsulation is the application: E-700/H-190 is the standard specification. Large-volume potting with exotherm concern: E-190/H-190. Thermal cycling or vibration: E-750/H-750.

 

Where E-132/H-100 Is Specified

E-132/H-100 is specified for electronic assemblies where the cured surface quality is part of the product specification - where a dull, blushed, or hazy surface is not acceptable output.

Appearance-sensitive electronic encapsulation. In electronic assemblies that are visible to the end user - display electronics, instruments, consumer-facing control panels, branded equipment - the potted surface is part of the product presentation. A general-purpose epoxy that cures with a dull or cloudy finish affects the finished product appearance. E-132/H-100 cures to a high-gloss surface that resists blushing. The cured surface does not develop a foggy or discolored condition over time under normal storage and handling.

 

Protective coating applications. The same properties that define E-132/H-100 for appearance-sensitive encapsulation - high gloss, blush resistance, toughness, and adhesion to most metal and plastic substrates - also make it appropriate as a protective or decorative surface coating applied over circuit boards, metal panels, or similar substrates.

 

Moisture protection. At 0.06% water absorption (25°C, 24 hours), E-132/H-100 provides the lowest moisture ingress rate in this product range. For assemblies in humid environments, condensation-exposure storage, or outdoor-adjacent conditions, this means slower moisture diffusion through the encapsulant body and longer effective protection of the potted components.

 

Surface Appearance: High Gloss and Resistance to Blushing

Figure 1. Blushing - the dull, foggy surface haze that develops on general-purpose epoxy under humid cure conditions - is visible as reduced gloss and a whitish film. E-132/H-100 cures to a high-gloss, blush-resistant surface.

 

Blushing - the development of a dull, foggy, or white-haze surface on a cured epoxy - is a common phenomenon with general-purpose epoxy systems, particularly when curing in humid environments or with certain hardener chemistries. The amine compounds used in many epoxy hardeners can react with moisture and carbon dioxide in the air at the curing surface, producing a surface layer with different optical and mechanical properties than the bulk cured material. The result is a cure surface that is noticeably less glossy, and in more severe cases, visibly hazy or discolored.

 

E-132/H-100 is formulated to resist surface blushing. The cured surface is high-gloss and clear in appearance, maintaining this finish without the dull or hazy surface condition commonly seen with general-purpose potting compounds - particularly when curing occurs in humid environments.

 

For product applications where the potted assembly is visible to the end user - consumer electronics, display instruments, branded industrial equipment - this surface finish difference is directly visible and affects the perceived quality of the finished product. For coating applications, the gloss and clarity of the cured surface layer are design properties in their own right.

 

Moisture Resistance: 0.06% Water Absorption

E-132/H-100 water absorption is 0.06% (25°C, 24 hours) - the lowest among the six formulas in the Fong Yong clear potting range:

Formula	Water Absorption (%)	Positioning
E-132/H-100	0.06	Appearance-sensitive / decorative coating
E-700/H-190	0.15	General-purpose
E-750/H-750	0.25	Flexible (Shore A 65), thermal cycling
E-600/H-600	0.33	LED encapsulation
E-120/H-100	0.43	RT cure primary
E-190/H-190	-	Large-volume / low exotherm (not published in TDS)

Low water absorption matters because moisture diffusing through the encapsulant reaches the component surface, solder joints, and conductor traces - where it can initiate corrosion, degrade insulation properties, and in severe cases cause conductive paths between conductors. Slower moisture ingress through the encapsulant body means longer effective protection of the potted assembly under humid service or storage conditions. At 0.06%, E-132/H-100 provides the most diffusion-resistant barrier in this range.

Figure 2. Water absorption comparison (%, 25°C 24 hours, TDS values). E-132/H-100 provides the lowest moisture uptake through the intact encapsulant body in this range - 0.06% versus 0.15% for E-700/H-190 and 0.43% for E-120/H-100.

 

Mechanical Properties: Tough and Impact-Resistant

E-132/H-100 cures to a tough, impact- and abrasion-resistant solid. Mechanical properties:

Hardness: Shore D 80

Compressive strength: 11,000 psi

Flexural strength: 11,000 psi

Tensile strength: 12,000 psi - highest tensile strength in this product range

Elongation: 7.0%

 

The combination of Shore D 80 hardness with 7.0% elongation means the cured material is hard in normal use but deforms slightly before fracture - giving it impact resistance that purely brittle rigid epoxies do not have. At 11,000 psi flexural strength, E-132/H-100 handles bending loads and handling impacts without cracking. For coating applications, this hardness and abrasion resistance provides durable surface protection in addition to the moisture barrier function of the coating layer.

 

Cure Conditions, Mix Ratio, and Processing

E-132/H-100 mix ratio is 3 parts E-132 to 1 part H-100 by weight. Both components are colorless, clear liquids: E-132 viscosity 2,000–8,000 cps; H-100 viscosity 10–100 cps. The system is 100% solid content - no volatile organic compounds, no solvent evaporation during cure. Pot life is 60 minutes at 25°C (60g sample); actual working time depends on batch size and ambient temperature.

 

Cure schedule:

Gel time at room temperature: 6–8 hours

Gel time with heat: 80°C × 40–60 minutes (varies with section size and thickness)

Full cure at room temperature: 7 days

Full cure with heat: 80°C × 2 hours

 

E-132/H-100 reaches full cure in a single oven stage at 80°C × 2 hours - no higher-temperature second step required. Standard 80°C production ovens are sufficient for the complete cure cycle.

 

Preparation: mix E-132 thoroughly before adding H-100 - this ensures any settled components in the resin are fully dispersed before combining. After mixing, scrape the mixture against the container wall and bottom to ensure full homogeneity. Vacuum deairing before pouring is recommended for a void-free coating or encapsulant layer.

 

Storage: store at 25°C or lower in a dry location. Keep away from sunlight, high temperature, and humidity. Prevent E-132 and H-100 from contaminating each other during storage.

 

Not Sure Whether E-132/H-100 Is the Right Formula for Your Application?

If appearance quality and water absorption are part of your specification, E-132/H-100 is the formula in this range that addresses both. If you are unsure whether the appearance or moisture requirement triggers the E-132 specification - or whether a different condition (thermal cycling, large volume, no oven) applies - use the four-variable selection guide.

→ Clear epoxy potting compound selection guide - four variables, six formulas

 

For understanding how moisture absorption affects potted component failure over time: Why Potted Electronic Components Fail →

 

Manufactured in Taiwan Under IATF 16949 Quality Standards

E-132/H-100 is produced by Fong Yong Chemical Co., Ltd. at its manufacturing facility in Taiwan. Fong Yong holds IATF 16949 certification - the international quality management system standard for automotive supply chains - which governs incoming material controls, process consistency, traceability, and quality documentation across its resin production operations.

 

The 0.06% water absorption figure published in the E-132/H-100 TDS is a production specification maintained under this quality system. For procurement teams requiring consistent, documented material performance - particularly for electronics assemblies destined for automotive, industrial, or high-reliability applications - IATF 16949 certification at the manufacturer level provides traceability and process control assurance that is not universally available from epoxy resin suppliers in the region.

 

Fong Yong has manufactured epoxy resin systems in Taiwan for over 40 years. Technical data sheets, batch documentation, and application engineering support are available on request.

Work With Fong Yong's Technical Team

Request a sample, obtain TDS documentation, get a quotation, or discuss your application with our engineering team.

Request Sample / TDS → Request Quotation → Technical Support →

 

Related Knowledge

How to Select a Clear Epoxy Potting Compound for Electronic Components: Four Variables That Determine the Right Formula

Why Potted Electronic Components Fail: Cracking, Delamination, and Moisture Ingress

Does Your Production Line Really Need an Oven? Room Temperature vs Heat Cure in Electronic Potting Epoxy

 

Technical content prepared by: Fong Yong Chemical Co., Ltd. Technical Team | Source: TDS E-132/H-100, 2024/07/16

 

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