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High Temp Encapsulation Epoxy ResinE532-1A(D)/H532-1B(D) is a two-part, fast cure, flammable retardant UL-94vo epoxy adhesive compound that cures at room temperature.
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High Thermal Conductivity Epoxy Potting Compound — 1.5 W/...E533/H533 delivers 1.5 W/m·K thermal conductivity and Tg 127°C for thick-section power electronics potting where heat accumulation causes component failure. Heat cure required. NOTE: UL follow-up
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Low-Stress Epoxy Potting For Stress-Sensitive Electronics...E-768 / H-768 is a soft, low-stress epoxy potting system designed to protect delicate electronic components without inducing cracking, solder fatigue, or curing stress. Ideal for stress-sensitive
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Flexible Epoxy Potting Compound Engineered Against Stress...E759 H759 semi-flexible epoxy potting compound designed for controlled stress distribution and system interaction. Taiwan manufacturer supporting bulk, wholesale, and customized supply.
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What Is Epoxy Resin? Material Fundamentals, Limitations, ...An engineering overview of epoxy potting compounds for electronics encapsulation. Compare cure options, rigidity, and production considerations, and navigate to product-specific pages for validation.
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Electrically Conductive Epoxy AdhesiveEP-1109-11 is a one-component, black, low halogen carbon-filled electrically conductive epoxy adhesive.
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Thermal Transfer Electronic Potting Epoxy AdhesiveE-590B-1/H-590 is a two-component, pourable, black, hard, thermally conductive epoxy potting compound.
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5 Minutes Epoxy Bonding AdhesiveFong Yong 5 minutes epoxy bonding adhesive E-906/H-906 is a two-component adhesive composed of epoxy resin and hardener.
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Electronic Potting Epoxy Resin | E-700/H-190 | Shore D 80...E-700/H-190 electronic potting epoxy resin. Shore D 80, 480 V/mil dielectric strength. RT or two-stage heat cure. Standard encapsulant for electronics.
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Flexible Epoxy Resin Potting CompoundFong Yong E759/H759 is a A/B component, ambient temperature cure, flame-retardant UL-94v0 modified epoxy resin, widely used on electronic potting, encapsulating and casting.
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Flexible Clear Epoxy Potting Compound for Thermal Cycling...E-750/H-750 is a Shore A 65 flexible epoxy potting compound that accommodates thermal expansion mismatch. Service temperature -30°C to +80°C. 1:1 mix ratio. RT or heat cure.
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Epoxy Potting Compound — UL94 V-0, Two-Stage Cure, HDT 13...E536/H536 is a flame-retardant 2-part epoxy potting compound designed for rigid encapsulation, thick-section stability, and long pot life processing. Made-to-order supply from Taiwan.E536/H536 is a
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