Epoxy Potting Compound

E-700/H-190 electronic potting epoxy resin. Shore D 80, 480 V/mil dielectric strength. RT or two-stage heat cure. Standard encapsulant for electronics.

Learn why flame-retardant epoxy potting is commonly used in transformer applications. This application overview explains thermal, electrical, and fire-safety design considerations without product

Fong Yong E759/H759 is a A/B component, ambient temperature cure, flame-retardant UL-94v0 modified epoxy resin, widely used on electronic potting, encapsulating and casting.

E-750/H-750 is a Shore A 65 flexible epoxy potting compound that accommodates thermal expansion mismatch. Service temperature -30°C to +80°C. 1:1 mix ratio. RT or heat cure.

E536/H536 is a flame-retardant 2-part epoxy potting compound designed for rigid encapsulation, thick-section stability, and long pot life processing. Made-to-order supply from Taiwan.E536/H536 is a

E-190/H-190 is a low-exotherm clear epoxy for large-component potting. Shore D 80, Tg 75°C, service temperature -30°C to +90°C. RT or heat cure (80°C × 2 hrs). Two mix ratio options.

Fong Yong EP-10C#7-BK is an one component, thermal curing epoxy adhesive for bonding, sealing, coating and encapsulation. It exhibits excellent physical properties, excellent electrical insulation