Epoxy Potting Compound

E-132/H-100 is a fast curing, low viscosity epoxy resin. It is an electronic/electrical grade epoxy potting compound, which is mainly used for potting, encapsulation, and casting to achieve

Learn why flame-retardant epoxy potting is commonly used in transformer applications. This application overview explains thermal, electrical, and fire-safety design considerations without product

Fong Yong E759/H759 is a A/B component, ambient temperature cure, flame-retardant UL-94v0 modified epoxy resin, widely used on electronic potting, encapsulating and casting.

E-750/H-750 1:1 Epoxy Potting and Encapsulating Compound is a two-component, flowable, electronic-grade compound that provides excellent physical, chemical, and electrical protection.

E536/H536 is a flame-retardant 2-part epoxy potting compound designed for rigid encapsulation, thick-section stability, and long pot life processing. Made-to-order supply from Taiwan.E536/H536 is a

E-190-BK/H-190 electronic potting epoxy resin is specially formulated to meet the high specification requirements of electronic/electrical components.

Fong Yong EP-10C#7-BK is an one component, thermal curing epoxy adhesive for bonding, sealing, coating and encapsulation. It exhibits excellent physical properties, excellent electrical insulation